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The Process of SMT and DIP manufacturing
Final Assembly and Packing |
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After delivery of volume production at the factory according to schedule,, we finally ship the end product to the location specified by the client. At this time we take into account all the controls and processes in the product flow , all our products each have their own barcode for easy tracking and inspection. Different products have their own individual processes, and we separate the production process into SMT and DIP technology. |
The Process of SMT and DIP manufacturing
From the moment the raw materials begin to enter the storage facilities, these raw materials and components start to be brought under strict management and control.
Once the materials have been brought together and on the production line (DIP process material or semi-complete product from the SMT stage), we then undergo a series of production procedures ?circuit board printing, component mounting, Re-soldering, AOI Inspection and refinement, and so on. During this procedure, ICP will make unscheduled spot checks according to production process needs, in order to ensure product quality and stability.. Finally, only after the last complete product spot-check inspection is the SMT process complete. We currently have 5 production lines in SMT, and its monthly capacity is on average around 45,000 units. We introduced YAMAHA Pick & Place which is famous from its speed, the speed for changing to different products on the same production line has been reduced from 2 hours to a mere 30 minutes.
When the SMT or DIP process has created a semi-complete product, we carry out pre-testing such as voltage rating, appearance and booting. After pre-testing, the production will shift to DIP plug-in, reflow, repair and finally to a static burn-in machine. Afterwards, there are two Quality Control testing stages. The first test will check all basic functions such as RS232,PCI/ISA Bus?The second test (applicance testing) will measure the actual application of the product, and during this stage we will undertake real installation integrating with the client needs and their software and carry out compatibility testing to ensure there are no compatibility issues with the product. In these three stages, all product failures will be transferred to the repair division for repair and testing. Products which pass muster will go straight to the LQC Dynamic Burn-in for final checking.
Final Assembly and Packing
When the product enters the final stage, it will undergo various inspections to ensure quality control. Faulty products will be delivered to the repair department for testing and repair. Only once this entire process is complete will the product enter the packaging and shipping stage.The entire stage includes rigorous quality control inspections throughout, and we take note of and test the product against all the client operating conditions. For example whether the heat given off when the product is being used will influence normal operations, firmware or software operating conditions. |
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